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Encrypted 3D components supported in HFSS 3D Layout for PCBs, IC packages and IC designs enable suppliers to share detailed 3D component designs for creating highly accurate simulations.Ansys HFSS Mesh Fusion enables simulation of large, never before possible electromagnetic systems with efficiency and scalability.Improved orientation optimization and new analysis types (Additive Prep).Creation of EOS and Renishaw build files (Additive Prep).Support part connectivity improvement (Workbench Additive).Automated calibration set up in Additive Wizard (Workbench Additive).
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Structural & Thermal Applications (FEA).Particle Simulation Applications (Rocky DEM).Forensic Engineering & Expert Witnesses.Fluid Flow & Thermal Applications (CFD).Electronic and Electrical Applications (EM).